Print

Multilayer printed circuits consisting of pure Teflon and mixed materials (FR4 and Teflon).

High frequency materials

Portfolio

Portfolio

  • Fusion bonding with high-temperature pressing up to 350°C
  • Heat sink technology
  • Mixed materials (FR4 + Teflon)
  • Thickness from 0.2 mm
  • Soft boards

Materials

Materials

  • Taconic (e.g. TLC, TLP, RF30, Taclam+, etc.)
  • Rogers (e.g. RO4350, RO3003, LCP)
  • Neltec (e.g. NX9250, NY9217, NY9320, etc.)
  • Arlon (e.g. CLTE, DiClad, etc.)
  • Isola (e.g. IS650, etc.)