One always needs to aim for the impossible to reach the possible.
Thick copper technology
Thick copper technology
Thick copper technologies up to 210 µm for power electronics.
HDI/Microvia-Technology
HDI/Microvia-TechnologY
The higher packaging density of components, like for example with BGAs require new layout structures. Through laser-via-technology or controlled mechanical deep drilling, the connections with the inner layers can be established by means of either staggered or stacked technology.
Portfolio
Portfolio
- 0.4 to 4.8 mm thickness
- Thinnest core 0.05 mm
- Format up to 569 x 490 mm
- Conductor path structures up to 75 µm
- Buried vias
- Blind vias
Materials
Materials
- FR4, TG 135°C with fillers
- FR4, high TG 170°C
- Halogen free materials
- Custom materials
Impedance-controlled PCBs
Impedance-controlled PCBs
The impedance of a conductor path depends on the following factors:
- the selected configuration (strip line, micro strip, etc.)
- the physical dimensions (width and height of the conductor path)
- the dielectric spacing (multilayer construction)
- the dielectric constant (Er) of the base material
Half copper-plated drills
Half copper-plated drills
Half copper-plated drills, e.g. in order to solder the PCB directly onto a metal frame